Combined audio jack and mobile electronic device enclosure

ABSTRACT

Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a non-provisional, claiming benefit under 35 U.S.C.§119(e), of U.S. Patent Application No. 61/696,111 filed Aug. 31, 2012for “Combined Audio Jack and Mobile Electronic Device Enclosure.” Theentire disclosure of the above mentioned application is incorporated byreference for all purposes.

BACKGROUND OF THE INVENTION

The present invention relates generally to enclosures for electronicdevices, and in particular enclosures including electrical connectorssuch as a receptacle connector for receiving an audio connector or plug.

Many electronic devices include electrical connectors that receive dataand, in some cases, receive and provide power and data. These electricalconnectors are typically receptacle connectors and are designed toreceive a male plug connector. The male plug connector may be on the endof a cable. The plug connector may plug into the receptacle connector,thereby forming one or more conductive paths for signals and/or power.

Receptacle connectors often have a shell that surrounds and providesmechanical support for contacts of the receptacle connector. Receptacleconnector shells are typically made from plastics. The contacts may bearranged to mate with corresponding contacts on the plug connector,e.g., an audio plug, to form portions of electrical paths betweendevices.

These receptacle connectors, e.g., audio jacks, are often manufacturedseparately from the enclosure and sometimes by a manufacturer differentthan the enclosure manufacturer. These off-the-shelf receptacleconnectors may be attached with bolts or otherwise fixed to enclosuresof electronic devices. Some receptacle connectors are customized for usewithin a specific electronic device or a group of electronic devices.These custom receptacle connectors may also be manufactured separatelyfrom the enclosure and inserted into the enclosure during the assemblyprocess of the electronic device.

As electronic devices continue to become smaller, these enclosures haveincreasingly limited internal space while still including a large numberof internal components. Limited space within the enclosures of devicescreates a number of challenges. For example, the limited internal spaceof these enclosures drives the demand for smaller internal componentssuch as smaller receptacle connector shells. However, smaller receptacleconnector shells that are compatible with industry standard connectorssuch as the 3.5 mm audio plug may not be available. Proprietary plugconnectors or 2.5 mm audio plugs that include smaller receptacleconnectors shells could be implemented in some situations but that wouldrequire consumers to purchase new devices and/or related accessories.

Many devices suffer from all or some of these deficiencies or fromsimilar deficiencies. Accordingly, it is desirable to provide enclosureshaving smaller internal components such as audio jacks.

BRIEF SUMMARY OF THE INVENTION

The present invention relates generally to enclosures for electronicdevices, and in particular enclosures integrally formed with a full orpartial receptacle connector shell for receiving electrical connectorssuch as audio connectors or plugs. For example, an enclosure made from apolymer may be integrally formed with an audio jack shell in aninjection molding process. As another example, an enclosure may beintegrally formed with one or more full or partial walls of an audiojack shell to form a single piece of polymer or metal and the remainingwalls of the audio jack shell may be overmolded to the polymer or metalwalls of the audio jack and proximate portions of the enclosure to forma full or complete audio jack shell. Accordingly, a receptacle connectorshell may be integrated with an enclosure of an electronic device toreduce the overall space requirements of the receptacle connector withinthe enclosure and/or potentially reduce the size of the enclosurerequired to contain the receptacle connector. This enclosure design mayalso be desirable because it may provide sealing between the receptacleconnector shell and the enclosure to protect against liquid ingress, astructurally robust receptacle connector shell, and reduced materialrequirements and manual assembly time.

According to one embodiment, an electronic device enclosure is provided.The electronic device enclosure can include a back portion that includesfront and back surfaces, left and right opposing walls, and top andbottom opposing walls. The bottom wall can include an opening thatcommunicates with a cavity. The electronic device enclosure can alsoinclude inner surfaces of a connector shell that define the cavity. Theconnector shell can be integrally formed with the back portion and thebottom wall and can be defined at least in part by: a top connectorshell portion extending from the bottom wall towards the top wall, firstand second opposing sidewalls extending from the bottom wall towards thetop wall, and a third sidewall opposite the bottom wall extendingbetween the first and second sidewalls. The first, second and thirdsidewalls can also extend from the top connector shell portion to theback portion. The enclosure can form a unified body that is formed froma single piece of material.

According to another embodiment, an electronic device enclosure isprovided. The electronic device enclosure can include a back portionthat includes front and back surfaces, left and right opposing walls,and top and bottom opposing walls. The bottom wall can include includingan opening. The front surface of the back portion can include first andsecond ridges disposed adjacent to and on opposite sides of the openingand extending towards the top wall. The first and second ridges caninclude a depth. The enclosure can form a unified body that is formedfrom a single piece of material.

According to yet another embodiment, an electronic device enclosure isprovided. The electronic device enclosure can include left and rightopposing walls and top and bottom opposing walls extending between theleft and right opposing walls. The bottom wall can include an opening.The electronic device enclosure can also include at least a portion of aconnector shell integrally formed with the bottom wall. The enclosurecan form a unified body that is formed from a single piece of material.

Although aspects of the invention are described in relation toenclosures integrally formed with reduced size audio jacks, it isappreciated that these features, aspects and methods can be used in avariety of different environments, regardless of receptacle connectorsize or type.

The enclosures described herein may be integrally formed with a varietyof different electrical connector shells, which may use a variety ofdifferent connector technologies. The invention may apply to manycommonly used connectors, including standard Universal Serial Bus (USB),a High-Definition Multimedia Interface (HDMI), Digital Visual Interface(DVI), DisplayPort, Thunderbolt, FireWire, power, Ethernet connectors,as well as many of the proprietary connectors, e.g., Apple's proprietary30-pin connector, used with common electronics. The invention may alsoapply to internal connectors or other connections between componentswithin the enclosure of an electronic device. Additionally, theinvention may apply to devices such as tablets, laptops, netbooks,desktops, and all-in-one computers; cell, smart, and media phones;storage devices, portable media players, navigation systems, monitors,and others.

To better understand the nature and advantages of the present invention,reference should be made to the following description and theaccompanying figures. It is to be understood, however, that each of thefigures is provided for the purpose of illustration only and is notintended as a definition of the limits of the scope of the presentinvention. Also, as a general rule, and unless it is evident to thecontrary from the description, where elements in different figures useidentical reference numbers, the elements are generally either identicalor at least similar in function or purpose.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a simplified illustrative block diagram representingan electronic media device that includes an audio receptacle connectoraccording to embodiments of the present invention;

FIG. 2 illustrates a rendering of one particular electronic mediadevice;

FIGS. 3A-B illustrate examples of audio plugs having three and fourconductive portions, respectfully;

FIG. 4A illustrates a sectional perspective view of a traditionalelectronic device enclosure having an audio jack mounted thereon;

FIG. 4B illustrates a cross-sectional view of a section of a traditionalenclosure having an audio jack mounted thereon and having a cover glassframe and a cover glass assembled therewith;

FIGS. 5A-B illustrate perspective and sectional perspective views,respectively, of an electronic device enclosure integrally formed withan audio jack shell;

FIG. 5C illustrates a cross-sectional view of a section of a unibodyenclosure integrally formed with audio jack shell and having a coverglass frame and a cover glass assembled therewith;

FIG. 6A illustrates a section of an electronic device enclosureintegrally formed with a partial audio jack shell;

FIGS. 6B and 6C illustrate two perspective views of a section of anelectronic device enclosure for an electronic device integrally formedwith a first partial audio jack shell and overmolded with a secondpartial audio jack shell; and

FIG. 7 illustrates a perspective view of an electronic device enclosurethat does not include a back portion and is integrally formed with anaudio jack shell.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will now be described in detail with reference tocertain embodiments thereof as illustrated in the accompanying drawings.In the following description, numerous specific details are set forth inorder to provide a thorough understanding of the present invention. Itwill be apparent, however, to one skilled in the art, that the presentinvention may be practiced without some or all of these specificdetails. In other instances, well known details have not been describedin detail in order not to unnecessarily obscure the present invention.

Before describing the present invention, electronic devices in which theinvention may be implemented and audio connectors or plugs correspondingto receptacle connectors of the invention are first described in thefollowing two sections.

I. Electronic Devices in Which the Invention may be Implemented

FIG. 1 is a simplified illustrative block diagram representing anelectronic media device 100 that includes an audio receptacle connector105 according to embodiments of the present invention. Electronic mediadevice 100 may also include, among other components, connectorreceptacle 110, one or more user input components 120, one or moreoutput components 125, control circuitry 130, graphics circuitry 135, abus 140, a memory 145, a storage device 150, communications circuitry155 and POM (position, orientation or movement sensor) sensors 160.Control circuitry 130 may communicate with the other components ofelectronic media device 100 (e.g., via bus 140) to control the operationof electronic media device 100. In some embodiments, control circuitry130 may execute instructions stored in a memory 145. Control circuitry130 may also be operative to control the performance of electronic mediadevice 100. Control circuitry 130 may include, for example, a processor,a microcontroller and a bus (e.g., for sending instructions to the othercomponents of electronic media device 100). In some embodiments, controlcircuitry 130 may also drive the display and process inputs receivedfrom input component 120.

Memory 145 may include one or more different types of memory that may beused to perform device functions. For example, memory 145 may includecache, flash memory, ROM, RAM and hybrid types of memory. Memory 145 mayalso store firmware for the device and its applications (e.g., operatingsystem, user interface functions and processor functions). Storagedevice 150 may include one or more suitable storage mediums ormechanisms, such as a magnetic hard drive, flash drive, tape drive,optical drive, permanent memory (such as ROM), semi-permanent memory(such as RAM) or cache. Storage device 150 may be used for storing media(e.g., audio and video files), text, pictures, graphics, advertising orany suitable user-specific or global information that may be used byelectronic media device 100. Storage device 150 may also store programsor applications that may run on control circuitry 130, may maintainfiles formatted to be read and edited by one or more of the applicationsand may store any additional files that may aid the operation of one ormore applications (e.g., files with metadata). It should be understoodthat any of the information stored on storage device 150 may instead bestored in memory 145.

Electronic media device 100 may also include input component 120 andoutput component 125 for providing a user with the ability to interactwith electronic media device 100. For example, input component 120 andoutput component 125 may provide an interface for a user to interactwith an application running on control circuitry 130. Input component120 may take a variety of forms, such as a keyboard/keypad, trackpad,mouse, click wheel, button, stylus or touch screen. Input component 120may also include one or more devices for user authentication (e.g., asmart card reader, a fingerprint reader or an iris scanner) as well asan audio input device (e.g., a microphone) or a video input device(e.g., a camera or a web cam) for recording video or still frames.Output component 125 may include any suitable display, such as a liquidcrystal display (LCD) or a touch screen display, a projection device, aspeaker or any other suitable system for presenting information or mediato a user. Output component 125 may be controlled by graphics circuitry135. Graphics circuitry 135 may include a video card, such as a videocard with 2D, 3D or vector graphics capabilities. In some embodiments,output component 125 may also include an audio component that isremotely coupled to electronic media device 100. For example, outputcomponent 125 may include a headset, headphones or ear buds that may becoupled to electronic media device 100 with a wire or wirelessly (e.g.,Bluetooth headphones or a Bluetooth headset).

Electronic media device 100 may have one or more applications (e.g.,software applications) stored on storage device 150 or in memory 145.Control circuitry 130 may be configured to execute instructions of theapplications from memory 145. For example, control circuitry 130 may beconfigured to execute a media player application that causes full-motionvideo or audio to be presented or displayed on output component 125.Other applications resident on electronic media device 100 may include,for example, a telephony application, a GPS navigator application, a webbrowser application and a calendar or organizer application. Electronicmedia device 100 may also execute any suitable operating system, such asMac OS, Apple iOS, Linux or Windows and can include a set ofapplications stored on storage device 150 or memory 145, whichapplications may be compatible with the operating system running on thedevice.

In some embodiments, electronic media device 100 may also includecommunications circuitry 155 to connect to one or more communicationsnetworks. Communications circuitry 155 may be any suitablecommunications circuitry operative to connect to a communicationsnetwork and to transmit communications (e.g., voice or data) fromelectronic media device 100 to other devices within the communicationsnetwork. Communications circuitry 155 may be operative to interface withthe communications network using any suitable communications protocolsuch as, for example, Wi-Fi (e.g., a 802.11 protocol), Bluetooth, highfrequency systems (e.g., 900 MHz, 2.4 GHz and 5.6 GHz communicationsystems), infrared, GSM, GSM plus EDGE, CDMA, quadband and othercellular protocols, VOIP or any other suitable protocol.

In some embodiments, communications circuitry 155 may be operative tocreate a communications network using any suitable communicationsprotocol. Communications circuitry 155 may create a short-rangecommunications network using a short-range communications protocol toconnect to other devices. For example, communications circuitry 155 maybe operative to create a local communications network using theBluetooth protocol to couple with a Bluetooth headset (or any otherBluetooth device). Communications circuitry 155 may also include a wiredor wireless network interface card (NIC) configured to connect to theInternet or any other public or private network. For example, electronicmedia device 100 may be configured to connect to the Internet via awireless network, such as a packet radio network, an RF network, acellular network or any other suitable type of network. Communicationcircuitry 145 may be used to initiate and conduct communications withother communications devices or media devices within a communicationsnetwork.

Electronic media device 100 may also include any other componentsuitable for performing a communications operation. For example,electronic media device 100 may include a power supply, an antenna,ports or interfaces for coupling to a host device, a secondary inputmechanism (e.g., an ON/OFF switch) or any other suitable component.

Electronic media device 100 may also include POM sensors 160. POMsensors 160 may be used to determine the approximate geographical orphysical location of electronic media device 100. As described in moredetail below, the location of electronic media device 100 may be derivedfrom any suitable trilateration or triangulation technique, in whichcase POM sensors 160 may include an RF triangulation detector or sensoror any other location circuitry configured to determine the location ofelectronic media device 100.

POM sensors 160 may also include one or more sensors or circuitry fordetecting the position orientation or movement of electronic mediadevice 100. Such sensors and circuitry may include, for example,single-axis or multi-axis accelerometers, angular rate or inertialsensors (e.g., optical gyroscopes, vibrating gyroscopes, gas rategyroscopes or ring gyroscopes), magnetometers (e.g., scalar or vectormagnetometers), ambient light sensors, proximity sensors, motion sensors(e.g., a passive infrared (PIR) sensor, active ultrasonic sensor oractive microwave sensor) and linear velocity sensors. For example,control circuitry 130 may be configured to read data from one or more ofPOM sensors 160 in order to determine the location orientation orvelocity of electronic media device 100. One or more of POM sensors 160may be positioned near output component 125 (e.g., above, below or oneither side of the display screen of electronic media device 100).

FIG. 2 depicts an illustrative rendering of one particular electronicmedia device 200. Device 200 includes a multipurpose button 205 as aninput component, a touch screen display 210 as both an input and outputcomponent, and a speaker 215 as an output component, all of which arehoused within a device housing 220. Device 200 also includes a primaryreceptacle connector 230 and an audio receptacle connector 235 or audiojack within device housing 220. Each of the receptacle connectors 230and 235 can be positioned within housing 220 such that an opening of thereceptacle connectors 230, 235 into which a corresponding plug connectoris inserted is located at an exterior surface of the device housing. Insome embodiments, these openings may be located at an exterior sidesurface of device 200. For simplicity, various internal components, suchas the control circuitry, graphics circuitry, bus, memory, storagedevice and other components are not shown in FIG. 2.

Electronic media device 200 may be a portable computing device; atablet; a smart or media phone; or a portable media player. However, asdiscussed earlier, embodiments of the present invention may beimplemented in laptops, desktops; all-in-one computers; cell phones,storage devices; navigation systems; monitors or other electronicdevices.

Embodiments of the invention disclosed herein pertain to an enclosureportion (not shown in FIG. 2) of housing 220 that is integrally formedwith audio receptacle connector 235, but in other embodiments theenclosure may be integrally formed with receptacle connector 230.Additionally, in some embodiments, housing 220 may only include a singlereceptacle connector 230 (as opposed to the two receptacle connectorsshown in FIG. 2) that is used to connect to other electronic devices. Inthese embodiments, the enclosure may be integrally formed withreceptacle connector 230.

II. Audio Connectors or Plugs Corresponding to Receptacle Connectors ofthe Invention

Embodiments of the present invention may include a receptacle connectorfor receiving an audio connector or plug, e.g., a standard audioconnector or plug. Standard audio plugs are available in three sizesaccording to the outside diameter of the plug: a 6.35 mm (¼″) plug, a3.5 mm (⅛″) miniature plug and a 2.5 mm ( 3/32″) subminiature plug. Theplugs include multiple conductive regions that extend along the lengthof the connectors in distinct portions of the plug such as the tip,sleeve and one or more middle portions between the tip and sleeveresulting in the connectors often being referred to as TRS (tip, ringand sleeve) connectors.

FIGS. 3A and 3B illustrate examples of audio plugs 310 and 320 havingthree and four conductive portions, respectfully. As shown in FIG. 3A,plug 310 includes a conductive tip 312, a conductive sleeve 316 and aconductive ring 314 electrically isolated from the tip 312 and thesleeve 316 by insulating rings 317 and 318. The three conductiveportions 312, 314, 316 are for left and right audio channels and aground connection, respectively. Plug 320, shown in FIG. 3B, includesfour conductive portions: a conductive tip 322, a conductive sleeve 326and two conductive rings 324, 325 and is thus sometime referred to as aTRRS (tip, ring, ring, sleeve) connector. The four conductive portions322, 324, 325 and 326 are electrically isolated by insulating rings 327,328 and 329 and are typically used for left and right audio, ground andmicrophone signals, respectively.

When plugs 310 and 320 are 3.5 mm miniature connectors, the outerdiameter of conductive sleeve 316, 326 and conductive rings 314, 324,325 is 3.5 mm and the insertion length of the connector is 14 mm. For2.5 mm subminiature connectors, the outer diameter of the conductivesleeve is 2.5 mm and the insertion length of the connector is 11 mmlong. Such TRS and TRRS connectors are used in many commerciallyavailable MP3 players and smart phones as well as other electronicdevices. Electronic devices such as MP3 players and smart phones arecontinuously being designed to be thinner and smaller and/or to includevideo displays with screens that are pushed out as close to the outeredge of the devices as possible. The diameter and length of current 3.5mm and even 2.5 mm audio connectors are limiting factors in making suchdevices smaller and thinner and in allowing the displays to be largerfor a given form factor.

The sizes of corresponding receptacle connectors or audio jacks for thestandard audio plugs connectors described above are also limitingfactors in making portable electronic devices smaller. An example oftraditional audio jacks mounted within an enclosure of an electronicdevice is shown in the following figures.

III. Prior Art

FIG. 4A illustrates a perspective view of a section of a traditionalelectronic device enclosure 400 having an audio jack 405 mountedthereon. Enclosure 400 includes a back portion 410 having bottom andleft walls 415, 420 as well as top and right walls (not shown in FIG.4A). Bottom wall 415 includes an opening (opening 465 shown in FIG. 4B)for access to audio jack 405.

Audio jack 405 is assembled on back portion 410, adjacent to an opening(opening 465 in FIG. 4B) on bottom wall 415. Audio jack 405 is mountedto back portion 410 via a screw (not shown in FIG. 4B) that is threadedthrough audio jack bracket 425 and threaded opening 430. Audio jack 405also includes contacts 435-439 for mating with corresponding contacts ona standard audio plug.

FIG. 4B illustrates a cross-sectional view of a section of traditionalelectronic device enclosure 400 having audio jack 405 mounted thereonand having a cover glass frame 440 and a cover glass 445 assembledtherewith. Cover glass frame 440 and cover glass 445 are held inposition by shelf 450 and other interlocking features (not shown in FIG.4B). As shown in FIG. 4B, an opening 470 of audio jack 405 is registeredwith opening 465 of bottom wall 415. Trim gasket 455 surrounds opening470 and is intended to seal gaps between enclosure 400 and audio jack405 in order to limit liquid ingress. A trim 460 may be included thatsurrounds opening 465. A standard audio plug may be inserted throughopening 465 and into opening 470 in order for its contacts to mate withcorresponding contacts 435-439 (not shown in FIG. 4B) of audio jack 405.

Embodiments of unified bodies including an enclosure and a full orpartial audio jack shell are discussed in the next section andpotentially may require less internal space, parts, cost and manualassembly time than traditional embodiments described above.

IV. Full and Partial Unibody Designs

Enclosures may be integrally formed with a full or partial receptacleconnector shell for receiving electrical connectors such as audioconnectors or plugs. In this manner, the enclosure may form a unifiedbody or unibody with a full or partial receptacle connector where theunibody is formed from a single piece of material. Examples of theseunibodies formed from a single piece of polymer or metal are discussedbelow.

A. Full Unibody Design

FIGS. 5A and 5B illustrate perspective and sectional perspective views,respectively, of an electronic device enclosure 500 integrally formedwith an audio jack shell 505. Enclosure 500 includes a back portion 510having top and bottom opposing walls 515, 520 and left and rightopposing walls 525, 530. Bottom wall may include an opening 535 (onlyshown in FIG. 5A), for receiving plug connectors, e.g., standard audioplugs. Back portion 510 and bottom wall 520 may be integrally formedwith audio jack shell 505 so as to form unibody enclosure 500 that isformed from a single piece of polymer or metal. Audio jack shell 505includes a front portion 501, a right sidewall 502 and an opposing leftside wall (not shown in FIGS. 5A-B), and a top wall 503. In someembodiments, contacts 540-544, for mating with corresponding contacts ona standard audio plug, may not be integrally formed with enclosure 500,but rather assembled separately.

This single piece enclosure 500 including audio jack shell 505 may beformed by injecting molten polymer, e.g., thermoplastics, or glassfilled resin, e.g., glass reinforced nylon, into a mold, i.e., injectionmolding, so as to form a single piece of polymer. Alternatively,enclosure 500 may be formed by molding Liquidmetal or a metal injectionmolding process (MIM) to form a single piece of metal, e.g., stainlesssteel.

FIG. 5C illustrates a cross-sectional view of a section of unibodyenclosure 500 integrally formed with audio jack shell 505 and having acover glass frame 545 and a cover glass 550 assembled therewith. Coverglass frame 545 and cover glass 550 are supported by shelf 551 (shown inFIGS. 5A-B) and other interlocking features (not shown in FIG. 5C). Asshown in FIG. 5C, opening 535 serves as the opening for enclosure 500and audio jack 505 because these elements are formed from a single pieceof material. Opening 535 may be configured to receive standard audioplugs. As compared to traditional enclosure 400 (as shown in FIGS. 4A-Band discussed above), the overall depth in which audio jack shell 505extends towards top wall 515 may be reduced by not including a trim(e.g., trim 460 as shown in FIG. 4B) or a trim gasket (e.g., gasket 455as shown in FIG. 4B). Not including a trim eliminates cosmetic gapsbetween an enclosure and the trim. However, the potential for liquidingress at the interface of the enclosure 500 and the audio jack 505 isalso eliminated by virtue of the elimination of the cosmetic gaps.Hence, trim gaskets may not be needed for enclosure 500 to fill gaps atseams between parts to prevent liquid ingress.

Although not shown in FIGS. 5A-5C, in some embodiments, enclosure 500may also include one or more additional openings (in addition to opening535) for providing access to more than one receptacle connector. Forexample, enclosure 500 may include openings for two receptacleconnectors such as receptacle connectors 230 and 235 (as shown in FIG.2). Furthermore, one or more of the additional receptacle connectors maybe integrated with embodiments of enclosure 500 in addition to orinstead of audio jack 505.

B. Partial Unibody Design

FIG. 6A illustrates a section of an electronic device enclosure 600integrally formed with a partial audio jack shell 605. Enclosure 600includes back portion 610 having a top wall (not shown in FIG. 6A)opposite a bottom wall 620 as well as left wall 625 opposite a rightwall (not shown in FIG. 6A). Bottom wall 620 may include an opening 630for receiving plug connectors, e.g., audio plugs. Back portion 610 andbottom wall 620 may be integrally formed with partial audio jack shell605 so at to form a unibody enclosure 600 from a single piece of polymeror metal. Partial audio jack shell 605 may include first and secondridges 635, 640 having interlocking pockets 645-647 and 648-650,respectively. Interlocking pockets 645-650 may be used for interlockingwith an overmolded part, as discussed below.

This single piece enclosure 600 including audio jack shell 605 may beformed by injecting molten polymer, e.g., thermoplastics, or glassfilled resin, e.g., glass reinforced nylon, into a mold, i.e., injectionmolding, so as to form a single piece of polymer. Alternatively,enclosure 600 may be formed by molding Liquidmetal or a metal injectionmolding process (MIM) to form a single piece of metal, e.g., stainlesssteel. In other embodiments, single piece enclosure 600 may be formed bycomputer numerical control (CNC) of a machining tool.

In some embodiments, enclosure 600 may include more or fewer ridges,e.g., ridges 635 and 640, than shown in FIG. 6A. For example, enclosure600 may include one ridge or three ridges. In other embodiments, otherportions of an audio jack shell may be integrally formed with enclosure600.

FIGS. 6B and 6C illustrate two perspective views of a section of anelectronic device enclosure 600 for an electronic device integrallyformed with a first partial audio jack shell 605 and overmolded with asecond partial audio jack shell 606 a. Second partial audio jack shell606 a may be formed over first partial audio jack shell 605 viaovermolding molten polymer over bottom wall 620, back portion 610 andfirst partial audio jack shell 605 to form a full audio jack shell, asshown in FIG. 6B. Second partial audio jack shell 606 b provides a viewof what second partial audio jack shell 606 a would look like if it wasseparated from enclosure 600 after the overmolding process. Secondpartial audio jack shell 606 a includes interlocking pegs 661-663 (shownon second partial audio jack shell 606 b) that correspond to pockets645-647 (shown in FIG. 6A) for locking second partial audio jack shell606 a to first partial audio jack shell 605. Second partial audio jackshell 606 a also includes additional interlocking pegs 671-673 (shown onsecond partial audio jack shell 606 b) corresponding to interlockingpockets 648-650 (shown in FIG. 6A). Second partial audio jack shell 606a may be implemented in embodiments where enclosure 600 includes partialaudio jack shell 605 and may be formed from a single piece of polymer ormetal.

In some embodiments, first partial audio jack shell 605 and/or secondpartial audio jack shell 606 a may include contacts (e.g., contacts540-544 shown in FIG. 5B) for mating with corresponding contacts on astandard audio plug. The contacts may be integrally formed withenclosure 600 or may be assembled with first partial audio jack shell605 and/or second partial audio jack shell 606 a separately, asdiscussed below. As shown in FIG. 6B, an opening 675 of residual audiojack shell 606 a is registered with opening 630 of bottom wall 620. Astandard audio plug may be inserted through opening 630 and into opening675 in order for its contacts to mate with corresponding contacts thatmay be implemented on first partial audio jack shell 605 and/or secondpartial audio jack shell 606 a.

Gaps occurring at seams—interfacing surfaces between two discreteparts—between enclosure 600 and second partial audio jack shell 606 amay be eliminated by virtue of the overmolding process which typicallydoes not leave gaps at the seams. In this manner, liquid ingress mayalso be prevented in these embodiments as well. However, in someembodiments, second partial audio jack shell 606 a may not be formed byovermolding, but rather by injection molding. Thereafter, the injectionmolded second partial audio jack shell 606 a may be assembled, e.g., viapress fitting, with enclosure 600. In these embodiments, assemblingsecond partial audio jack shell 606 a with enclosure 600 may result inseams with gaps; gaskets or sealants may be used at the gap locations toprevent liquid ingress.

In some embodiments, second partial audio jack shell 606 a may be formedby a multiple-shot overmolding process wherein each overmolding processforms a different part of second partial audio jack shell 606 a. Eachovermolding process may use different types of polymers.

Embodiments of enclosure 600 may achieve similar benefits to that ofenclosure 500 discussed above. In addition, enclosure 600 may besuitable with metal enclosures and/or allow for the use of more than onematerial implemented for an audio jack shell. For example, in somesituations, it may be desirable to use glass filled resin for part of anaudio jack for its structural properties and a cosmetic non-glass filledresin, e.g., polycarbonate, for parts of the audio jack exposed to theusers of electronic devices.

Although not shown in FIGS. 6A-6C, in some embodiments, enclosure 600may also include one or more additional openings (in addition to opening630) for providing access to more than one receptacle connector. Forexample, enclosure 600 may include openings for two receptacleconnectors such as receptacle connectors 230 and 235 (as shown in FIG.2). Furthermore, one or more of the additional receptacle connectors maybe integrated with embodiments of enclosure 600 in addition to orinstead of audio jack 605.

C. Metal Trim

In some embodiments, it may be desirable to include a trim, as discussedwith regards to the prior art, in the enclosure embodiments describedabove. The trim, which may be made from a metallic material, may beassembled with the enclosure and surround a receptacle connector openingof a bottom wall of an enclosure. Cosmetic gaps between the enclosureand the metal trim are removed by virtue of the insert molding processthat may fill in potential gaps at the seams between the enclosure andthe metal trim. It may be desirable for enclosures according to thepresent invention to include a metal trim in order to prevent wearcaused by inserting and extracting plug connectors, e.g., TRS or TRRSaudio plugs, into and from the opening of the enclosure,

D. Assembly of Contacts for Audio Jacks

Contacts implemented on enclosures of the present invention may bemanually assembled using a press fit connection or insert molded in anovermolding process applied to a full or partial audio jack integrallyformed with an enclosure. Similarly, contacts may be manually assembledusing a press fit connection or insert molded in an overmolding processapplied to a residual audio jack overmold.

V. Alternative Unibody Designs

Although embodiments disclosed herein relate to receptacle connectorshells (e.g., audio jack shells) integrally formed with a back portionand bottom wall of an enclosure, enclosures according to the presentinvention may include receptacle connector shells integrally formed withany walls or portions of the enclosure. For example, a receptacleconnector shell could be integrally formed with the back portion and thetop wall. As another example, a receptacle connector shell could beintegrally formed with the back portion and the top and left walls. Asyet another example, the receptacle connector shell may not beintegrally formed with a back portion of an enclosure, but rather withone or more two walls of the enclosure, e.g., bottom and right walls.The following figure illustrates an example of a unibody enclosure thatdoes not include a back portion.

FIG. 7 illustrates a perspective view of an electronic device enclosure700 that does not include a back portion and is integrally formed withan audio jack shell 705. Enclosure 700 includes top and bottom opposingwalls 715, 720 and left and right opposing walls 725, 730. Bottom wallmay include an opening 735, for receiving plug connectors, e.g.,standard audio plugs. Bottom wall 720 may be integrally formed withaudio jack shell 705 so as to form unibody enclosure 700 that is formedfrom a single piece of polymer or metal. Audio jack shell 705 includes afront portion 701, a right sidewall 702 and an opposing left side wall(not shown in FIG. 7), and a top wall 703. In some embodiments, contacts740-744 for mating with corresponding contacts on a standard audio plugmay not be integrally formed with enclosure 700 but rather assembledseparately.

As with other embodiments discussed herein, single piece enclosure 700,including audio jack shell 705, may be formed by injecting moltenpolymer, e.g., thermoplastics, or glass filled resin, e.g., glassreinforced nylon, into a mold, i.e., injection molding, so as to form asingle piece of polymer. Alternatively, enclosure 700 may be formed bymolding Liquidmetal or a metal injection molding process (MIM) to form asingle piece of metal, e.g., stainless steel.

Although not shown in FIG. 7, in some embodiments, enclosure 700 mayalso include one or more additional openings (in addition to opening735) for providing access to more than one receptacle connector. Forexample, enclosure 700 may include openings for two receptacleconnectors such as receptacle connectors 230 and 235 (as shown in FIG.2). Furthermore, one or more of the additional receptacle connectors maybe integrated with embodiments of enclosure 700 in addition to orinstead of audio jack 705.

Other components described herein may be integrally formed with an audiojack shell that is integrally formed with an enclosure, according toembodiments of the present invention. That is, components adjacent toaudio jack shells could share one or more walls with the audio jackshell. Other components could also be formed integrally within theenclosure regardless of their proximity to the audio jack housing. Forexample, components could be integrated with walls of the enclosure orjust the back portion of the enclosure.

Also, while a number of specific embodiments were disclosed withspecific features, a person of skill in the art will recognize instanceswhere the features of one embodiment can be combined with the featuresof another embodiment. For example, some specific embodiments of theinvention set forth above were illustrated with audio jacks. A person ofskill in the art will readily appreciate that any of the types ofreceptacle connectors described herein may be integrally formed with anenclosure, as well as other internal components specifically mentionedherein and not specifically mentioned herein. Also, those skilled in theart will recognize, or be able to ascertain using no more than routineexperimentation, many equivalents to the specific embodiments of theinventions described herein. Such equivalents are intended to beencompassed by the following claims.

What is claimed is:
 1. An electronic device enclosure, comprising: aback portion, the back portion having front and back surfaces; left andright opposing walls; top and bottom opposing walls, the bottom wallincluding an opening that communicates with a cavity extendinglongitudinally towards the top wall; and inner surfaces of a connectorshell defining the cavity, the connector shell integrally formed withthe back portion and the bottom wall, the connector shell defined atleast in part by: a top connector wall extending from the bottom walltowards the top wall; first and second opposing sidewalls extending fromthe bottom wall towards the top wall; a front portion opposite thebottom wall extending between the first and second sidewalls; and aportion of the back portion of the electronic device enclosure, theportion extending between the first and second opposing sidewalls andextending between the bottom wall and the front portion; wherein thefirst and second sidewalls and the front portion also extend from thetop wall to the back portion; and wherein the enclosure forms a unifiedbody formed from a single piece of material.
 2. The enclosure of claim1, wherein the connector shell is configured to receive an audio pluginserted through the opening.
 3. The enclosure of claim 1, wherein thematerial is metal.
 4. The enclosure of claim 1, wherein the material isa polymer.
 5. The enclosure of claim 1, wherein the connector shellincludes contacts to form portions of electrical paths for mating withcorresponding contacts on an electrical connector.
 6. An electronicdevice enclosure, comprising: a back portion having front and backsurfaces; left and right opposing walls emanating from the frontsurface; and a bottom wall emanating from the front surface, the bottomwall including an opening; wherein the front surface of the back portionincludes first and second ridges integrally formed with the back portionand disposed adjacent to and on opposite sides of the opening andextending away from the bottom wall, the first and second ridges havinga first depth and a plurality of pockets formed therein; and a connectorshell having a plurality of pegs corresponding to the plurality ofpockets and overmolded on the first and second ridges; wherein theenclosure forms a unified body with the connector shell.
 7. Theenclosure of claim 6, wherein the front surface of the back portionincludes a third ridge extending between the first and the secondridges.
 8. The enclosure of claim 6, wherein the enclosure is formedusing an injection molding process.
 9. The enclosure of claim 6, whereinthe plurality of pockets are oriented in a first plane that is parallelto a plane in which the front surface of the back portion is oriented,the plurality of pockets having a second depth.
 10. The enclosure ofclaim 9, wherein the connector shell is formed from a polymer andovermolded to the first and second ridges, a portion of a back surfaceof the bottom wall, and a portion of the front surface of the backportion so as to define a cavity of the opening.
 11. The enclosure ofclaim 10, wherein the connector shell includes contacts to form portionsof electrical paths for mating with corresponding contacts on anelectrical connector.
 12. The enclosure of claim 9, wherein theconnector shell integrally formed with the first and second ridges so asto define a cavity of the opening.
 13. The enclosure of claim 12,wherein the pegs are configured to be formed within the plurality ofpockets.
 14. The enclosure of claim 6, wherein the enclosure is madefrom a polymer.